Vaporization device

ABSTRACT

The present application relates to a vaporization device. The proposed vaporization device includes a heating component top cap, a heating component base, and a heating component disposed between the heating component top cap and the heating component base. The heating component includes a first part and a second part, the first part including a first material, and the second part including a second material, the first material is different from the second material.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a national stage application filed under 35 U.S.C 371 of International Application No. PCT/CN2019/106023 filed Sep. 16, 2019. The entire disclosure of the above application is incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present disclosure generally relates to a vaporization device, and in particular, to an electronic device that provides inhalable aerosol.

2. Description of the Related Art

An electronic cigarette is an electronic product that heats and vaporizes a vaporizable solution to generate aerosol for a user to inhale. In recent years, major manufacturers begin to produce various electronic cigarette products. Generally, the electronic cigarette product includes a casing, an e-liquid storage chamber, a vaporization chamber, a heating component, an air inlet, an air flow channel, an air outlet, a power supply device, a sensing device, and a control device. The e-liquid storage chamber is configured to store the vaporizable solution, and the heating component is configured to heat and vaporize the vaporizable solution and generate an aerosol. The air inlet is in communication with the vaporization chamber, and air is supplied to the heating component when a user inhales. The aerosol generated by the heating component is first generated in the vaporization chamber, and then inhaled by the user through the airflow channel and the air outlet. The power supply device provides power required for the heating component, and the control device controls heating time of the heating component based on an inhalation action of the user detected by the sensing device. The casing covers each of the components.

The heating component of an existing electronic cigarette product usually includes a cotton core. There are advantages of use of the cotton core as a main part of the heating component, for example, low manufacturing costs of the cotton core and large amount of aerosol generated during heating. However, there are many disadvantages of use of the cotton core as the heating component. For example, debris of the cotton core may be inhaled by the user through the air outlet of the electronic cigarette, which may be harmful to health of the user. In addition, a porosity of the cotton core is too large, so that it is difficult to absorb e-liquid well. A too large porosity of the cotton core also causes the electronic cigarette to easily leak e-liquid. In addition, by heating the cotton core to vaporize the e-liquid, high-temperature e-liquid often splashes. High-temperature e-liquid splashed from the air outlet of the electronic cigarette often scalds the user.

In addition, pressure balance of the e-liquid storage chamber is not taken into account for the existing electronic cigarette product. In the existing electronic cigarette product, the e-liquid storage chamber is generally designed to be completely sealed to prevent the vaporizable solution from overflowing. As users continue to use the electronic cigarette products, the vaporizable solution in the e-liquid storage chamber is continuously consumed and reduced, causing a decrease in a pressure in the e-liquid storage chamber to form a negative pressure. The negative pressure causes the vaporizable solution in the e-liquid storage chamber to be difficult to flow uniformly to the heating component, so that the heating component does not uniformly adsorb the vaporizable solution. In this case, when the temperature of the heating component rises, there is a high probability of dry-burning and scorching, causing a poor user experience.

Therefore, a vaporization device and a heating component thereof that can resolve the foregoing problem is proposed.

SUMMARY OF THE INVENTION

A vaporization device is proposed. The proposed vaporization device includes a heating component top cap, a heating component base, and a heating component disposed between the heating component top cap and the heating component base. The heating component includes a first part and a second part, the first part including a first material, and the second part including a second material, where the first material is different from the second material.

A vaporization device is proposed. The proposed vaporization device includes a heating component top cap, a heating component base, and a heating component disposed between the heating component top cap and the heating component base. The heating component includes a heating circuit, a first part, and a second part. The first part includes a first material, and the second part includes a second material, where a compressive strength of the first material is different from a compressive strength of the second material

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are readily understood from the following detailed description when read in combination with the accompanying figures. It should be noted that various features may not be drawn to scale, and dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 illustrates an assembly view of a vaporization device according to some embodiments of the present disclosure.

FIG. 2A and FIG. 2B illustrate exploded diagrams of a part of a vaporization device according to some embodiments of the present disclosure.

FIG. 2C illustrates a schematic enlarged diagram of a heating component according to some embodiments of the present disclosure.

FIGS. 3A and 3B illustrate temperature simulation diagrams of a heating component according to some embodiments of the present disclosure.

FIG. 4A and FIG. 4B illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

FIG. 5A and FIG. 5B illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

FIG. 6A, FIG. 6B and FIG. 6C illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

FIG. 7A and FIG. 7B illustrate three-dimensional diagrams of a heating component top cap according to some embodiments of the present disclosure.

FIG. 8A and FIG. 8B illustrate sectional diagrams of a cartridge according to some embodiments of the present disclosure.

Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. Features of the present disclosure will be clearer according to the following detailed description made in combination with the accompanying drawings.

PREFERRED EMBODIMENT OF THE PRESENT INVENTION

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below. These are, of course, merely examples and are not intended to be limiting. In the present disclosure, references to the formation of a first feature on or above a second feature in the following description may include an embodiment formed through a direct contact of the first feature with the second feature, and may further include an additional feature that may be formed between the first feature and the second feature, so that the first feature may not be in direct contact with the second feature. In addition, according to the present disclosure, reference numerals and/or letters may be repeated in various examples. This repetition is for simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Embodiments of the present disclosure are discussed in detail below. It should be understood, however, that the present disclosure provides many applicable concepts that may be implemented in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative and do not limit the scope of the present disclosure.

FIG. 1 illustrates an assembly view of a vaporization device according to some embodiments of the present disclosure.

A vaporization device 10 may include a cartridge 10A and a body 10B. In some embodiments, the cartridge 10A and the body 10B may be designed as a whole. In some embodiments, the cartridge 10A and the body 10B may be designed as two separate components. In some embodiments, the cartridge 10A may be designed to be removably engaged with the body 10B. In some embodiments, the cartridge 10A may be designed to be partially accommodated in the body 10B.

The body 10B may include a plurality of members. Although not shown in FIG. 1 , the body 10B may include members that may be required during operation of the vaporization device 10 such as a conductive pogo pin, a sensor, a circuit board, a light guide component, a buffer component, a power supply component (for example, but not limited to a battery or a rechargeable battery), a power supply component bracket, a motor, and a charging panel, etc. The body 10B may supply power to the cartridge 10A. The power supplied by the body 10B to the cartridge 10A may heat a vaporizable material stored in the cartridge 10A. The vaporizable material may be a kind of liquid. The vaporizable material may be a solution. In subsequent paragraphs of the present disclosure, the vaporizable material may also be referred to as e-liquid. The e-liquid is edible.

FIG. 2A and FIG. 2B illustrate exploded views of cartridges according to some embodiments of the present disclosure.

The cartridge 10A includes a casing 1, a top cap seal member 2, a heating component top cap 3, a heating component seal member 4, a heating component 5, and a heating component base 6. A heating circuit 5 c may be provided on a surface of the heating component 5. In some embodiments, the heating circuit may also be disposed inside the heating component 5.

As shown in FIG. 2A, the top cap seal member 2 may have a plurality of openings. The heating component top cap 3 may have a plurality of openings. In some embodiments, a quantity of openings of the top cap seal member 2 may be the same as a quantity of openings of the heating component top cap 3. In some embodiments, a quantity of openings of the top cap seal member 2 may be different from a quantity of openings of the heating component top cap 3. In some embodiments, a quantity of openings of the top cap seal member 2 may be less than a quantity of openings of the heating component top cap 3. In some embodiments, a quantity of openings of the top cap seal member 2 may be greater than a quantity of openings of the heating component top cap 3.

In some embodiments, the top cap seal member 2 may have elasticity. In some embodiments, the top cap seal member 2 may have flexibility. In some embodiments, the top cap seal member 2 may include silica gel. In some embodiments, the top cap seal member 2 may be made of silica gel.

The heating component top cap 3 may have buckle portions 3 d 1 and 3 d 2. The heating component base 6 may have buckle portions 6 d 1 and 6 d 2. The heating component top cap 3 and the heating component base 6 may be coupled using the buckle portions 3 d 1, 3 d 2, 6 d 1, and 6 d 2. The heating component top cap 3 and the heating component base 6 may be mechanically engaged using the buckle portions 3 d 1, 3 d 2, 6 d 1, and 6 d 2. The heating component top cap 3 and the heating component base 6 may be removably engaged using the buckle portions 3 d 1, 3 d 2, 6 d 1, and 6 d 2.

When a part or all of the components of the cartridge 10A are engaged with each other, the top cap seal member 2 may cover a part of the heating component top cap 3. The top cap seal member 2 may surround a part of the heating component top cap 3. The top cap seal member 2 may expose a part of the heating component top cap 3.

When a part or all of the components of the cartridge 10A are engaged with each other, the heating component seal member 4 may cover a part of the heating component 5. The heating component seal member 4 may surround a part of the heating component 5. The heating component seal member 4 may expose a part of the heating component 5.

In some embodiments, the heating component seal member 4 may have elasticity. In some embodiments, the heating component seal member 4 may have flexibility. In some embodiments, the heating component seal member 4 may include silica gel. In some embodiments, the heating component seal member 4 may be made of silica gel.

As shown in FIG. 2A, the heating component seal member 4 has an opening 4 h, and the heating component 5 has a groove 5 c. When the heating component seal member 4 and the heating component 5 are engaged with each other, the opening 4 h may expose at least one part of the groove 5 c.

As shown in FIG. 2B, the top cap seal member 2 may have an extending part 2 t. When the top cap seal member 2 and the heating component top cap 3 are engaged with each other, the extending part 2 t extends into a channel in the heating component top cap 3.

As shown in FIG. 2B, the heating component 5 includes a heating circuit 5 c. In some embodiments, the heating circuit 5 c may be disposed on a bottom surface of the heating component 5. In some embodiments, the heating circuit 5 c may be exposed on the bottom surface of the heating component 5. In some embodiments, the heating circuit 5 c may be disposed inside the heating component 5. In some embodiments, the heating circuit 5 c may be partially covered by the heating component 5. In some embodiments, the heating circuit 5 c may be totally covered by the heating component 5.

FIG. 2C illustrates a schematic enlarged diagram of a heating component according to some embodiments of the present disclosure.

As shown in FIG. 2C, the heating component 5 may have a pore. In some embodiments, a shape of the pore may be in a shape of a square. In some embodiments, a shape of the pore may be in a shape of a cylinder. In some embodiments, a shape of the pore may be in a shape of a ring. In some embodiments, a shape of the pore may be in a shape of a hexagonal column. In some embodiments, a shape of the pore may be in a shape a honeycomb structure.

E-liquid may penetrate into the pore of the heating component 5. The pore of the heating component 5 may be infiltrated in the e-liquid. The pore of the heating component 5 may increase a contact area between the heating component 5 and the e-liquid. The pore of the heating component 5 may surround small molecules of e-liquid from all sides. During heating, the pore of the heating component 5 may heat the e-liquid more uniformly. During heating, the pore of the heating component 5 may cause the e-liquid to reach a preset temperature more rapidly. During heating, the pore of the heating component 5 may prevent burnt odor from being generated.

The pore of the heating component 5 may include an open pore and a closed pore. The open pore is an opening that is not completely closed on all sides, and e-liquid may enter the open pore. The closed pore is a cavity that is completely closed on all sides, and e-liquid cannot enter the closed pore.

The e-liquid may penetrate into a place near the heating circuit 5 c through the open pore. Adjustment of a number of the open pores (or referred to as an open porosity) in the heating component 5 may help to adjust a speed at which the e-liquid penetrates into the heating component 5. Adjustment of a number of the open pores in the heating component 5 may help to adjust a volume of the e-liquid that is penetrated into the heating component 5.

Air is included in the closed pore. The air included in the closed pore may separate a basic material of the heating component from the e-liquid. Because air has a relatively small thermal conductivity coefficient of 0.024 W/(mK), adjustment of a number of closed pores (or a closed porosity) in the heating component 5 may help to adjust a thermal conductivity coefficient of a three-phase composite of the basic material/e-liquid/air of the heating component. Adjustment of the closed porosity in the heating component 5 may help to adjust an overall thermal conductivity coefficient of the heating component 5.

When a number of the closed pores in the heating component 5 is increased, the overall thermal conductivity coefficient of the heating component 5 decreases. Decrease of the thermal conductivity coefficient may cause the heating component 5 to heat in a more concentrated manner Decrease of the thermal conductivity coefficient may cause heating efficiency of the heating component 5 to be higher. Decrease of the thermal conductivity coefficient may cause the heating component 5 to generate a larger smoke amount.

A porosity of the heating component 5 is equal to a sum of the open porosity and the closed porosity. The porosity of the heating component 5 is related to a structural strength of the heating component 5. The porosity of the heating component 5 is related to a compressive strength of the heating component 5. In the case where the strength of the heating component 5 is maintained, a desired e-liquid penetration ratio and generated smoke amount may be achieved through adjustment of the open porosity and closed porosity. In some embodiments, the porosity of the heating component 5 may be in a range of 35% to 95%. In some embodiments, the open porosity of the heating component 5 is in a range of 30% to 60%, and the closed porosity thereof is in a range of 5% to 35%.

FIGS. 3A and 3B illustrate temperature simulation diagrams of a heating component according to some embodiments of the present disclosure.

FIG. 3A shows a cross-sectional temperature of a heating component 5. In a temperature simulation diagram shown in FIG. 3A, an overall thermal conductivity coefficient of the heating component 5 is 0.1. A temperature of the heating component 5 gradually decreases as a distance from a heating circuit 5 c increases. As shown in FIG. 3A, a temperature T1 is about 543.44° C. A temperature T2 is about 356.75° C. A temperature T3 is about 280.80° C. A temperature T4 is about 173.18° C. A temperature T5 is about 115.03° C. A temperature T6 is about 35.78° C. A temperature T7 is about 25.56° C.

FIG. 3B shows a cross-sectional temperature of a heating component 5. In a temperature simulation diagram shown in FIG. 3B, an overall thermal conductivity coefficient of the heating component 5 is 2.0. A temperature of the heating component 5 gradually decreases as a distance from a heating circuit 5 c increases. As shown in FIG. 3B, a temperature T1′ is about 205.84° C. A temperature T2′ is about 165.91° C. A temperature T3′ is about 137.89° C. A temperature T4′ is about 107.96° C. A temperature T5′ is about 88.51° C. A temperature T6′ is about 73.03° C. A temperature T7′ is about 65.58° C.

It can be known through a comparison of a temperature simulation diagrams of FIG. 3A and FIG. 3B that when the overall thermal conductivity coefficient of the heating component 5 is low, thermal energy generated by the heating component 5 is concentrated near the heating circuit 5 c. Concentration of the thermal energy at the heating circuit 5 c may help to improve heating efficiency. Concentration of the thermal energy at the heating circuit 5 c may help to reduce power dissipation. Concentration of the thermal energy at the heating circuit 5 c may help to increase a smoke generation speed. Concentration of the thermal energy at the heating circuit 5 c may help to increase a generated smoke volume.

The heating component 5 may be made of different materials. The heating component 5 may include at least one of silicon oxide, aluminum oxide, and zirconium oxide. The heating component 5 may include a mixture of two of the silicon oxide, the aluminum oxide, and the zirconium oxide. The heating component 5 may include a mixture of the silicon oxide, the aluminum oxide, and the zirconium oxide.

The silicon oxide, the aluminum oxide, and the zirconium oxide have different material characteristics.

Generally, the silicon oxide has the lowest thermal conductivity coefficient among the three, but the silicon oxide has the lowest compressive strength among the three.

The thermal conductivity coefficient of the silicon oxide is about 1 W/(mK). The thermal conductivity coefficient of the zirconium oxide is about 3 W/(mK). The thermal conductivity coefficient of the aluminum oxide is about 27 W/(mK). The compressive strength of the silicon oxide is about 80 Mpa (one million Pascals). The compressive strength of the zirconium oxide is about 900 Mpa. The compressive strength of the aluminum oxide is about 300 Mpa. The compressive strength of the material according to the present disclosure may be measured using a strength tester. There is certain method and condition for measuring the compressive strength, and the compressive strength is recorded according to an established standard.

The material and porosity of the heating component 5 may be adjusted according to requirements, so that the vaporization device 10 generates a desired smoke amount.

In a first embodiment, the heating component 5 uses a single material of silicon oxide, and the heating component 5 is controlled during manufacturing to have an open porosity of 60% and a closed porosity of 35%. The heating component 5 designed in such a manner has a compressive strength of 10 Mpa. The overall thermal conductivity coefficient of the heating component 5 is 0.12 W/(mK). In this embodiment, a single inhalation action of a user may cause the heating component 5 to generate a smoke amount of 9 milligrams (mg).

In a second embodiment, the heating component 5 uses a mixed material of aluminum oxide and silicon oxide. A mass ratio of aluminum oxide to silicon oxide is 1:10. The heating component 5 is controlled during manufacturing to have an open porosity of 40% and a closed porosity of 25%. The heating component 5 designed in such a manner has a compressive strength of 25 Mpa. The overall thermal conductivity coefficient of the heating component 5 is 1.3 W/(mK). In this embodiment, a single inhalation action of a user may cause the heating component 5 to generate a smoke amount of 6.5 milligrams (mg).

In a third embodiment, the heating component 5 uses a mixed material of aluminum oxide and silicon oxide. A mass ratio of aluminum oxide to silicon oxide is 1:5. The heating component 5 is controlled during manufacturing to have an open porosity of 50% and a closed porosity of 5%. The heating component 5 designed in such a manner has a compressive strength of 40 Mpa. The overall thermal conductivity coefficient of the heating component 5 is 2.6 W/(mK). In this embodiment, a single inhalation action of a user may cause the heating component 5 to generate a smoke amount of 4.5 milligrams (mg).

FIG. 4A and FIG. 4B illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

A heating component 51 shown in FIG. 4A and a heating component 52 shown in FIG. 4B may be used as alternative components of the heating component 5 shown in FIG. 2A and FIG. 2B. The heating component top cap 3, the heating component seal member 4, and the heating component base 6 shown in FIG. 2A and FIG. 2B may be correspondingly modified according to appearances of the heating component 51 and the heating component 52.

As mentioned in the previous paragraph, a relatively low thermal conductivity coefficient may increase heating efficiency of the heating component 5. However, a relatively low compressive strength may cause a problem. For example, the relatively low compressive strength may cause the heating component 5 to be defective during production, and thus reduce a production yield of the heating component 5. In addition, during the use of the vaporization device 10, the heating component 5 having the relatively low compressive strength may cause debris to fall. Falling debris may be inhaled by the user and cause a heath hazard. Therefore, there is an urgent need for a heating component that takes both the heating efficiency and the compressive strength into consideration.

The heating component 51 shown in FIG. 4A includes a composite material. The heating component 51 shown in FIG. 4A includes a composite structure. The heating component 51 shown in FIG. 4A includes a main part 51 m 1 formed of a first material, and a bottom 51 m 2 formed of a second material. In some embodiments, a compressive strength of the first material is greater than a compressive strength of the second material. In some embodiments, a thermal conductivity coefficient of the second material is less than a thermal conductivity coefficient of the first material. The heating component 51 may include a heating circuit 51 c disposed at the bottom. The heating circuit 51 c may be disposed on a surface of the bottom 51 m 2 formed of the second material.

Because the first material has a relatively high compressive strength, the main part 51 m 1 formed of the first material may reduce a chance of damage to the heating component 51 during production. In addition, the main part 51 m 1 formed of the first material may reduce a chance of debris falling during use of the vaporization device 10.

Because the thermal conductivity coefficient of the second material is smaller than the thermal conductivity coefficient of the first material, the bottom 51 m 2 formed of the second material may improve heating efficiency of the heating component 51. In addition, the bottom 51 m 2 formed of the second material may increase a smoke amount generated by the heating component 51 and a smoke generation speed.

In some embodiments, the main part 51 m 1 may include a zirconium oxide. In some embodiments, the bottom 51 m 2 may include silicon oxide. In some embodiments, the main part 51 m 1 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the bottom 51 m 2 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the main part 51 m 1 and the bottom 51 m 2 include mixtures with different composition ratios of zirconium oxide, silicon oxide, or aluminum oxide.

The heating component 52 shown in FIG. 4B includes a composite material. The heating component 52 shown in FIG. 4B includes a composite structure. The heating component 52 shown in FIG. 4B includes a surface part 52 m 1 formed of a first material and a main part 52 m 2 formed of a second material. The heating component 52 may include a heating circuit 52 c (not shown) disposed at the bottom.

As shown in FIG. 4B, the surface part 52 m 1 may cover a first surface 52 s 1 and a second surface 52 s 2 of the main part 52 m 2. In some embodiments, the surface part 52 m 1 does not cover a bottom of the heating component 52. The surface part 52 m 1 exposes the bottom of the heating component 52. In some embodiments, the surface part 52 m 1 may cover the bottom of the heating component 52. In some embodiments, the surface part 52 m 1 does not cover inner walls 52 r 1 and 52 r 2 of a groove 52 r. In some embodiments, the surface part 52 m 1 may partially cover the inner wall 52 r 1 or 52 r 2 of the groove 52 r. In some embodiments, the surface part 52 m 1 may completely cover the inner walls 52 r 1 and 52 r 2 of the groove 52 r.

In some embodiments, a thermal conductivity coefficient of the first material is greater than a thermal conductivity coefficient of the second material. In some embodiments, a compressive strength of the first material is greater than a compressive strength of the second material. In some embodiments, the surface part 52 m 1 may include zirconium oxide. In some embodiments, the main part 52 m 2 may include silicon oxide.

In some embodiments, the surface part 52 m 1 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the main part 52 m 2 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the surface part 52 m 1 and the main part 52 m 2 include mixtures with different composition ratios of zirconium oxide, silicon oxide, or aluminum oxide.

Because the surface part 52 m 1 has a relatively high compressive strength, the surface part 52 m 1 may reduce a chance of damage to the heating component 52 during production. In addition, the surface part 52 m 1 may reduce a chance of debris falling during use of the vaporization device 10.

Because the thermal conductivity coefficient of the second material is smaller than the thermal conductivity coefficient of the first material, the main part 52 m 2 may improve the heating efficiency of the heating component 52. In addition, the main part 52 m 2 formed of the second material may increase a smoke amount generated by the heating component 52 and a smoke generation speed.

FIG. 5A and FIG. 5B illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

A heating component 53 shown in FIG. 5A and a heating component 54 shown in FIG. 5B may be used as alternative components of the heating component 5 shown in FIG. 2A and FIG. 2B. The heating component top cap 3, the heating component seal member 4, and the heating component base 6 shown in FIG. 2A and FIG. 2B may be correspondingly modified according to appearances of the heating component 53 and the heating component 54.

The heating component 53 shown in FIG. 5A includes a single structure. In some embodiments, the heating component 53 includes a main part 53 m 1 and a heating circuit 53 c. In some embodiments, the main part 53 m 1 may include a single material. In some embodiments, the main part 53 m 1 may include a mixture. In some embodiments, the main part 53 m 1 may include a single material of zirconium oxide. In some embodiments, the main part 53 m 1 may include a single material of silicon oxide. In some embodiments, the main part 53 m 1 may include a single material of aluminum oxide. In some embodiments, the main part 53 m 1 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide.

In some embodiments, the main part 53 m 1 may be in a cylindrical shape. In some embodiments, the main part 53 m 1 may be in other shapes. The heating circuit 53 c may be wound around a surface of the main part 53 m 1. The heating circuit 53 c may include a nickel metal, a chromium metal, or an iron-nickel alloy.

The heating component 54 shown in FIG. 5B includes a composite material. The heating component 54 shown in FIG. 5B includes a composite structure.

The heating component 54 shown in FIG. 5B includes a main part 54 m 1 formed of a first material, and a surface part 54 m 2 formed of a second material. In some embodiments, a thermal conductivity coefficient of the first material is smaller than a thermal conductivity coefficient of the second material. In some embodiments, a compressive strength of the second material is greater than a compressive strength of the first material.

The heating component 54 having a composite structure has many advantages.

Because the surface part 54 m 2 has a relatively high compressive strength, the surface part 54 m 2 may reduce a chance of damage to the heating component 54 during production. In addition, the surface part 54 m 2 may reduce a chance of debris falling during use of the vaporization device 10.

Because the thermal conductivity coefficient of the first material is smaller than the thermal conductivity coefficient of the second material, the main part 54 m 1 may improve the heating efficiency of the heating component 54. In addition, the main part 54 m 1 formed of the first material may increase a smoke amount generated by the heating component 54 and a smoke generation speed.

In some embodiments, the surface part 54 m 2 may include zirconium oxide. In some embodiments, the main part 54 m 1 may include silicon oxide. In some embodiments, the main part 54 m 1 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the surface part 54 m 2 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the main part 54 m 1 and the surface part 54 m 2 include mixtures with different composition ratios of zirconium oxide, silicon oxide, or aluminum oxide. The heating circuit 54 c may be wound around a surface of the surface part 54 m 2. The heating circuit 54 c may include a nickel metal, a chromium metal, or an iron-nickel alloy.

FIG. 6A, FIG. 6B and FIG. 6C illustrate schematic three-dimensional diagrams of a heating component according to some embodiments of the present disclosure.

A heating component 55 shown in FIG. 6A, a heating component 56 shown in FIG. 6B, and a heating component 57 shown in FIG. 6C may be used as alternative components of the heating component 5 shown in FIG. 2A and FIG. 2B. The heating component top cap 3, the heating component seal member 4, and the heating component base 6 shown in FIG. 2A and FIG. 2B may be correspondingly modified according to appearances of the heating components 55, 56, and 57.

The heating component 55 shown in FIG. 6A includes a single structure. In some embodiments, the heating component 55 includes a main part 55 m 1 and a heating circuit 55 c. The heating circuit 55 c may be disposed on a bottom surface 55 s of the heating component 55. Although not shown in FIG. 6A, in some embodiments, the heating component 55 may include a groove on a top surface.

In some embodiments, the main part 55 m 1 may include a single material. In some embodiments, the main part 55 m 1 may include a mixture. In some embodiments, the main part 55 m 1 may include a single material of zirconium oxide. In some embodiments, the main part 55 m 1 may include a single material of silicon oxide. In some embodiments, the main part 55 m 1 may include a single material of aluminum oxide. In some embodiments, the main part 55 m 1 may include a mixture of zirconium oxide, silicon oxide, or aluminum oxide. In some embodiments, the main part 55 m 1 may be in a rectangular shape.

The main part 55 m 1 may have the length 55L1, the width 55L2, and the thickness 55L3. In some embodiments, the length 55L1 may be greater than the width 55L2 and the thickness 55L3. In some embodiments, the width 55L2 may be substantially the same as the thickness 55L3. In some embodiments, the width 55L2 may be different from the thickness 55L3. In some embodiments, the main part 55 m 1 may be in other shapes.

The heating component 55 may be made by a foam-gelcasting method. In an embodiment in which the main part 55 m 1 includes a single material of zirconium oxide, the main part 55 m 1 may have parameter characteristics such as a porosity of 78%, a compressive strength of 11 Mpa, and a thermal conductivity coefficient of 0.14 W/(mK). In an embodiment in which the main part 55 m 1 includes a single material of zirconium oxide, the main part 55 m 1 may have parameter characteristics such as a porosity of 68%, a compressive strength of 23 Mpa, and a thermal conductivity coefficient of 0.39 W/(mK).

The heating component 56 shown in FIG. 6B includes a composite material. The heating component 56 shown in FIG. 6B includes a composite structure. The heating component 56 shown in FIG. 6B includes a main part 56 m 1 formed of a first material, and a bottom 56 m 2 formed of a second material. In some embodiments, a compressive strength of the first material is greater than a compressive strength of the second material. In some embodiments, a thermal conductivity coefficient of the second material is less than a thermal conductivity coefficient of the first material. The heating component 56 may include a heating circuit 56 c disposed at the bottom. The heating circuit 56 c may be disposed on a surface of the bottom 56 m 2 formed of the second material. Although not shown in 6B, in some embodiments, the heating component 56 may include a groove on a top surface.

Because the first material has a relatively high compressive strength, the main part 56 m 1 formed of the first material may reduce a chance of damage to the heating component 56 during production. In addition, the main part 56 m 1 formed of the first material may reduce a chance of debris falling during use of the vaporization device 10.

Because the thermal conductivity coefficient of the second material is smaller than the thermal conductivity coefficient of the first material, the bottom 56 m 2 formed of the second material may improve heating efficiency of the heating component 56. In addition, the bottom 56 m 2 formed of the second material may increase a smoke amount generated by the heating component 56 and a smoke generation speed.

As shown in FIG. 6B, the main part 56 m 1 may have the thickness of 56L1, and the bottom part 56 m 2 may have the thickness of 56L2. Through adjustment of a ratio of the thickness 56L1 to the thickness 56L2, an overall thermal conductivity coefficient of the heating component 56 may be adjusted. Through adjustment of a ratio of the thickness 56L1 to the thickness 56L2, a smoke amount and a smoke generation speed of the heating component 56 may be adjusted. In some embodiments, the thickness 56L1 may be greater than the thickness 56L2. In some embodiments, the thickness 56L1 may be equal to the thickness 56L2. In some embodiments, the thickness 56L1 may be smaller than the thickness 56L2.

In some embodiments, the thermal conductivity coefficient of the main part 56 m 1 is in a range of 0.12 W/(mK) to 2.6 W/(mK). In some embodiments, the thermal conductivity coefficient of the main part 56 m 1 is in a range of 0.1 W/(mK) to 5 W/(mK). In some embodiments, the thermal conductivity coefficient of the main part 56 m 1 is in a range of 0.1 W/(mK) to 10 W/(mK). In some embodiments, the compressive strength of the main part 56 m 1 is greater than 10 Mpa.

In some embodiments, the overall thermal conductivity coefficient of the heating component 56 is in a range of 0.12 W/(mK) to 2.6 W/(mK). In some embodiments, the overall thermal conductivity coefficient of the heating component 56 is in a range of 0.1 W/(mK) to 5 W/(mK). In some embodiments, the overall thermal conductivity coefficient of the heating component 56 is in a range of 0.1 W/(mK) to 10 W/(mK). In some embodiments, an overall compressive strength of the heating component 56 is greater than 10 Mpa.

A heating component 57 shown in FIG. 6C includes a composite material. The heating component 57 shown in FIG. 6C includes a composite structure. The heating component 57 shown in FIG. 6C includes a surface part 57 m 1 formed of a first material, and a main part 57 m 2 formed of a second material. The heating component 57 may include a heating circuit 57 c disposed at the bottom. Although not shown in 6C, in some embodiments, the heating component 57 may include a groove on a top surface.

In some embodiments, the surface part 57 m 1 may cover a plurality of surfaces of the heating component 57.

The heating component 57 shown in FIG. 6C has a rectangular shape. In some embodiments, the surface part 57 m 1 may cover three faces of the rectangular shape. In some embodiments, the surface part 57 m 1 may cover four faces of the rectangular shape. In some embodiments, the surface part 57 m 1 may cover five faces of the rectangular shape.

In some embodiments, the surface part 57 m 1 does not cover a bottom of the heating component 57. The surface part 57 m 1 exposes the bottom of the heating component 57. In some embodiments, the surface part 57 m 1 may cover the bottom of the heating component 57. As shown in FIG. 6C, the surface part 57 m 1 and the main part 57 m 2 formed of the first material may have the thickness 57L2. Through adjustment of a ratio of the thickness 57L1 to the thickness 57L2, an overall thermal conductivity coefficient of the heating component 57 may be adjusted. Through adjustment of a ratio of the thickness 57L1 to the thickness 57L2, a smoke amount and a smoke generation speed of the heating component 57 may be adjusted. In some embodiments, the thickness 57L1 may be greater than the thickness 57L2. In some embodiments, the thickness 57L1 may be equal to the thickness 57L2. In some embodiments, the thickness 57L1 may be smaller than the thickness 57L2.

FIG. 7A and FIG. 7B illustrate three-dimensional diagrams of a heating component top cap according to some embodiments of the present disclosure.

A heating component top cap 3 has openings 3 h 1, 3 h 3, 3 h 4, and 3 h 5 on a surface 3 s 1. The opening 3 h 1 extends into the heating component top cap 3 to form a channel (such as a channel 3 c 1 shown in FIG. 8A). The opening 3 h 3 extends into the heating component top cap 3 to form a channel (such as a channel 3 c 2 shown in FIG. 8A). The opening 3 h 4 extends into the heating component top cap 3 to form a channel (such as a channel 3 c 3 shown in FIG. 8A). The opening 3 h 5 extends into the heating component top cap 3 to form a channel (such as a channel 3 c 4 shown in FIG. 8A). In some embodiments, the heating component top cap 3 may have more channels. In some embodiments, the heating component top cap 3 may have fewer channels.

The heating component top cap 3 has columnar portions 3 w 1 and 3 w 2. A groove 3 r 1 is defined between the columnar portion 3 w 1 and the columnar portion 3 w 2. The groove 3 r 1 is in fluid communication with the opening 3 h 5. The groove 3 r 1 is in fluid communication with the channel 3 c 4 (as shown in FIG. 8A) of the heating component top cap 3. The groove 3 r 1 is in fluid communication with a vaporization chamber 6C (see FIG. 8A).

As shown in FIG. 7B, the heating component top cap 3 has an opening 3 h 2 on a surface 3 s 2. The opening 3 h 1 penetrates through the opening 3 h 2 that is of the heating component top cap 3 and that is from the surface 3 s 1 to the surface 3 s 2, to form a channel 3 c 1. In some embodiments, the openings 3 h 1 and 3 h 2 may be aligned with each other in a vertical direction. In some embodiments, the openings 3 h 1 and 3 h 2 may not be aligned with each other in the vertical direction.

FIG. 8A and FIG. 8B illustrate sectional diagrams of a cartridge according to some embodiments of the present disclosure.

As shown in FIG. 8A, a casing 1 has an opening 1 h and a tube 1 t extending from the opening 1 h to a top cap seal member 2. The tube 1 t, the top cap seal member 2, and the casing 1 define a liquid storage compartment 20. A vaporizable material may be stored in the liquid storage compartment 20.

The tube 1 t may have a part extending into a channel 3 c 4. The tube 1 t may have a non-uniform outer diameter. As shown in FIG. 8A, a part that is of the tube 1 t and that extends into the channel 3 c 4 has a relatively small outer diameter. The tube 1 t may have a non-uniform inner diameter. As shown in FIG. 8A, a part that is of the tube 1 t and that extends into the channel 3 c 4 has a relatively small inner diameter.

The tube 1 t is coupled to the channel 3 c 4 through an opening 3 h 5 of a heating component top cap 3. The tube 1 t is in fluid communication with the channel 3 c 4 through an opening 3 h 5 of the heating component top cap 3. The channel 3 c 4 is isolated from the liquid storage compartment 20 through the tube 1 t.

As shown in FIG. 8A, the top cap seal member 2 may expose openings 3 h 3, 3 h 4, and 3 h 5 of the heating component top cap 3. The top cap seal member 2 does not cover the openings 3 h 3, 3 h 4 and 3 h 5 of the heating component top cap 3. The top cap seal member 2 does not block the channel 3 c 2, 3 c 3, and 3 c 4.

The channel 3 c 2 is in fluid communication with the groove 5 c of the heating component 5. The channel 3 c 3 is in fluid communication with the groove 5 c of the heating component 5. E-liquid stored in the liquid storage compartment 20 may flow into the groove 5 c through the channel 3 c 2. The e-liquid stored in the liquid storage compartment 20 may flow into the groove 5 c through the channel 3 c 3. The groove 5 c of the heating component 5 is in fluid communication with the liquid storage compartment 20. The e-liquid may be in full contact the heating component 5 in the groove 5 c. A heating circuit on a surface or an inside of the heating component 5 may heat the e-liquid and generate aerosol.

A vaporization chamber 6C is defined between a heating component base 6 and the heating component 5. The heating component 5 is partially exposed in the vaporization chamber 6C. Aerosol generated by the heating component 5 is formed in the vaporization chamber 6C. The aerosol generated by the heating component 5 is inhaled by a user through the tube 1 t and the opening 1 h. The tube 1 t is in fluid communication with the vaporization chamber 6C. The groove 3 r 1 is in fluid communication with the vaporization chamber 6C.

The top cap seal member 2 may cover the opening 3 h 1 of the heating component top cap 3. The top cap seal member 2 may block the channel 3 c 1.

As shown in FIG. 8A, the heating component top cap 3 has a block 3 p. The block 3 p isolates the tube 1 t from the groove 5 c of the heating component 5. The block 3 p isolates the channel 3 c 4 from the groove 5 c of the heating component 5.

During use of the vaporization device, when condensed liquid remaining in the tube 1 t reaches a specific volume, the condensed liquid may slip off the tube 1 t. The block 3 p may prevent the condensed liquid sliding from the tube 1 t from being in contact with the heating component 5. The block 3 p may prevent the slipping condensed liquid from contaminating the heating component 5. The block 3 p may prevent the slipping condensed liquid from changing a taste of the aerosol. The block 3 p may prevent the condensed liquid from sliding down to a high-temperature heating component and causing the liquid to splash. The block 3 p may prevent the splashed liquid from scalding the user.

FIG. 8B shows an air flow 6 f from a vaporization chamber 6C to a liquid storage compartment 20.

When a vaporization device is left standing and not sucked by the user, an opening 3 h 1 is tightly engaged with a top cap seal member 2, and e-liquid in the liquid storage compartment 20 does not leak out from a channel 3 c 1.

As a user continues to use the vaporization device, a vaporizable material in the liquid storage compartment 20 is continuously consumed and reduced, so that a pressure in the liquid storage compartment 20 is gradually reduced. If the pressure in the liquid storage compartment 20 is reduced, a negative pressure may be generated. The reduced pressure in the liquid storage compartment 20 may make it difficult for a volatile solution to flow to a groove 5 c of the heating component 5 through channels 3 c 2 and 3 c 3. When the groove 5 c does not completely adsorb the volatile solution, the high-temperature heating component 5 may drily burn and generate a burnt smell.

The above problem may be resolved by disposing a channel 3 c 1 in the heating component top cap 3. The channel 3 c 1 disposed in the heating component top cap 3 may balance the pressure in the liquid storage compartment 20. Because the vaporization chamber 6C is in fluid communication with the tube 1 t, a pressure in the vaporization chamber 6C is approximately equal to one atmospheric pressure. When the vaporizable solution in the liquid storage compartment 20 is continuously reduced, a pressure in the liquid storage compartment 20 is gradually less than one atmospheric pressure. A pressure difference between the vaporizable chamber 6C and the liquid storage compartment 20 causes the air flow 6 f from the vaporization chamber 6C to reach a junction between the opening 3 h 1 and the top cap seal member 2 through the channel 3 c 1. The airflow 6 f may partially push the top cap seal member 2 away. The air flow 6 f may cause a partial deformation of the top cap seal member 2. The airflow 6 f may enter the liquid storage compartment 20 through a gap generated by the deformation of the top cap seal member 2. The airflow 6 f entering the liquid storage compartment 20 may increase the pressure in the liquid storage compartment 20. The airflow 6 f entering the liquid storage compartment 20 may balance a pressure between the liquid storage compartment 20 and the vaporization chamber 6C.

In some embodiments, the heating component top cap 3 may be additionally provided with a channel having a same function as the channel 3 c 1. For example, the heating component top cap 3 may also be provided with a ventilation channel near the opening 3 h 4.

As used herein, spatially relative terms such as “below”, “lower”, “bottom”, “upper”, “top”, “bottom”, “left”, “right” and the like may be used for simplicity in the description herein to describe a relationship of one component or feature with the other component or feature as illustrated in figures. In addition to orientations depicted in the figures, the spatially relative terms are intended to cover different orientations of the device in use or operation. The apparatus may be oriented in other manners (being rotated at 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. It should be understood that when an component is referred to as being “connected to” or “coupled to” another component, the component may be directly connected or coupled to another component, or an intermediate component may be present.

As used herein, the terms “approximately,” “substantially,” “substantial” and “about” are used to describe and account for small variations. When used in conjunction with an event or a circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. As used herein with respect to a given value or range, the term “about” generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. The range may be expressed herein as being from one endpoint to another endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein include endpoints. The term “substantially coplanar” may refer to two surfaces within a few micrometers (μm) positioned along a same plane, for example, within 10 μm, 5 μm, 1 μm, or 0.5 μm positioned along a same plane. When referring to “substantially” the same value or characteristic, the term may refer to a value that is within ±10%, ±5%, ±1%, or ±0.5% of an average of the values.

As used herein, the terms “approximately,” “substantially,” “substantial,” and “about” are used to describe and explain small variations. When used in conjunction with an event or a circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, when used in conjunction with a numerical value, the terms can refer to a range of variation less than or equal to ±10% of that numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a difference between two values is less than or equal to ±10% (for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%) of an average of the values, the two values can be considered to be “substantially” or “about” the same. For example, “substantially” parallel may refer to a range of angular variation less than or equal to ±10° with respect to 0°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, “substantially” perpendicular may refer to a range of angular variation less than or equal to ±10° with respect to 90°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

For example, if a displacement between two surfaces is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, the two surfaces may be considered to be coplanar or substantially coplanar. If a displacement between any two points on a surface relative to a plane is equal to or less than 5 μm, equal to or less than 2 μm, equal to or less than 1 μm, or equal to or less than 0.5 μm, the surface may be considered to be flat or substantially flat.

As used herein, the terms “conductive,” “electrically conductive” and “electrical conductivity” refer to an ability to transport an electric current. Electrically conductive materials typically indicate those materials that exhibit little or no opposition to the flow of an electric current. One measure of electrical conductivity is Siemens per meter (S/m). Typically, an electrically conductive material is one having a conductivity greater than approximately 10⁴ S/m, such as at least 10⁵ S/m or at least 10⁶ S/m. The electrical conductivity of a material can sometimes varies with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

As used herein, the singular terms “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise. In the description of some embodiments, components provided “on” or “above” another component may encompass a case in which a previous component is directly on a latter component (for example, in physical contact with the latter component), and a case in which one or more intermediate components are located between the previous component and the latter component.

Unless otherwise specified, space descriptions such as “above”, “below”, “up”, “left”, “right”, “down”, “top”, “bottom”, “vertical”, “horizontal”, “side face”, “higher than”, “lower than”, “upper portion”, “on”, “under”, “downward”, etc. are indicated relative to orientations shown in the figures. It should be understood that the spatial description used herein is for illustrative purposes only, and the actual implementation of a structure described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments disclosed herein are not deviated due to such arrangement.

Although the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It may be clearly understood by those skilled in the art that various changes may be made and equivalent components may be replaced in the embodiments without departing from the true spirit and scope of the present disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to variables in the manufacturing process, etc., there may be a difference between the artistic reproduction in the present disclosure and an actual apparatus. There may be other embodiments of the present disclosure that are not specifically described. The specification and drawings should be regarded to be illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, substance, method, or process to the objectives, spirit, and scope of the present disclosure. All such modifications are intended to be within the scope of the appended claims appended. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided, or reordered without departing from the teachings of the present disclosure to form equivalent methods. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

The foregoing outlines features of several embodiments and details of the present disclosure. The embodiments described in the present disclosure may be easily used as a basis for designing or modifying other processes and for performing the same or similar purposes and/or obtaining a structure having the same as or similar advantages with those of the embodiments introduced herein. Such equivalent constructions do not depart from the spirit and scope of the present disclosure, and various changes, substitutions, and changes may be made without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. A vaporization device, comprising: a heating component top cap; a heating component base; and a heating component disposed between the heating component top cap and the heating component base, wherein the heating component comprises a first part and a second part, the first part comprising a first material, and the second part comprising a second material, the first material is different from the second material.
 2. The vaporization device according to claim 1, wherein the first material comprises zirconium oxide, and the second material comprises silicon oxide.
 3. The vaporization device according to claim 1, wherein the first material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide.
 4. The vaporization device according to claim 1, wherein a compressive strength of the first material is greater than a compressive strength of the second material.
 5. The vaporization device according to claim 1, wherein a thermal conductivity coefficient of the first material is greater than a thermal conductivity coefficient of the second material.
 6. The vaporization device according to claim 1, wherein the heating component further comprises a heating circuit disposed on a surface of the second part.
 7. The vaporization device according to claim 1, wherein a thickness of the first part is greater than a thickness of the second part.
 8. The vaporization device according to claim 1, wherein the first part covers a first surface, a second surface, and a third surface of the second part.
 9. The vaporization device according to claim 1, wherein a thermal conductivity coefficient of the heating component is in a range of 0.12 W/(mK) to 2.6 W/(mK).
 10. The vaporization device according to claim 1, wherein a compressive strength of the first part is greater than 10 Mpa.
 11. The vaporization device according to claim 1, wherein the heating component further comprises a heating circuit that is wound around the heating component.
 12. A vaporization device, comprising: a heating component top cap; a heating component base; and a heating component disposed between the heating component top cap and the heating component base, wherein the heating component comprises a heating circuit, a first part, and a second part, the first part comprising a first material, and the second part comprising a second material, wherein a thermal conductivity coefficient of the first material is different from a thermal conductivity coefficient of the second material.
 13. The vaporization device according to claim 12, the heating component further comprising a groove, wherein the first part covers a first surface and a second surface of the second part, and the first part exposes a first surface and a second surface of the groove.
 14. The vaporization device according to claim 12, wherein the heating component comprises a plurality of pores, a porosity of the heating component being in a range of 35% to 95%.
 15. The vaporization device according to claim 14, wherein the plurality of pores include open pores and closed pores, an open porosity of the heating component being in a range of 30% to 60%, and a closed porosity of the heating component being in a range of 5% to 35%.
 16. The vaporization device according to claim 12, wherein the heating circuit is in direct contact with the second part, a compressive strength of the second part being smaller than a compressive strength of the first part.
 17. The vaporization device according to claim 12, wherein a thermal conductivity coefficient of the heating component is in a range of 0.1 W/(mK) to 10 W/(mK).
 18. The vaporization device according to claim 12, wherein a thickness of the first part is different from a thickness of the second part.
 19. The vaporization device according to claim 12, wherein the second material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide.
 20. The vaporization device according to claim 12, wherein the first part covers a first surface, a second surface, and a third surface of the second part. 